May 30th to June 2nd, 2017
Venue: Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida
Website: http://www.ectc.net/
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
Located in the heart of the most magical place on earth, the Walt Disney World Swan and Dolphin Resort provides a truly extraordinary backdrop for a meeting.
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.