Browse by Manufacturer: NexFlash Technologies, Inc.

Manufacturer Code: NEXFLASH

Winbond Electronics Corp. is a Specialty Memory IC Company engaged in design, manufacturing and sales services. From product design, research and development, wafer fabrication to marketing of brand name product, Winbond endeavors to provide its global clientele top quality of low to medium density memory solutions. The Company was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarters in the Central Taiwan Science Park, Taichung, Taiwan. Winbond has three core business groups - DRAM Product, Flash Memory IC, and Memory IC Manufacturing. It continuously seeks product and technological innovation to gain a competitive edge. Winbond’s major product lines include Code Storage Flash Memory, Specialty DRAM and Mobile DRAM. Our advantage of technological autonomy and prudent capacity strategy enables us to build a highly flexible production system to produce the synergy of product mix, and meet customer demands while building the brand image. In the area of Code Storage Flash Memory products, we focus on the "low to medium density" market by offering a full range of products of Serial and Parallel Flash. Our small-size flash memory packages offer the features of low pin count, small size and low cost. With considerable market share in computer peripheral markets, we also develop mobile device and consumer electronic related fields. Winbond specializes in the design of high-performance, low-power memory, and riding on the strength of having a 12-inch fab, offers a whole series of Mobile DRAM and Specialty DRAM products that target top-tier clientele and quality-oriented applications. Winbond’s products are used extensively in handheld devices, consumer electronics and computer peripherals. We also focus on high entry barrier, high-quality applications, such as KGD, automobile and industrial electronics.

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