Results for: GBLCSC03LFT74 in Thermal Management
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Thermal Management

Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Techniques for heat dissipation can include heatsinks and fans for air cooling, and other forms of computer cooling such as liquid cooling. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.

Thermal Management > ESD Suppressors

Part No.	DS	Manufacturer	D/C	Qty	Region	Action
GBLCSC03-LF-T74		ProTek	2009	4000	China	Request A Quote
GBLCSC03-LF-T74		ProTek	2009+	2535	Japan	Request A Quote
GBLCSC03-LF-T74		ProTek	2023+	45670	China	Request A Quote
GBLCSC03-LF-T74		ProTek	-	3435	Canada	Request A Quote

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