Results for: P3100SCLRP in Thermal Management
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Thermal Management

Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure.Techniques for heat dissipation can include heatsinks and fans for air cooling, and other forms of computer cooling such as liquid cooling. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation. Thermal management measures must be taken to accommodate high heat release equipment in telecommunications rooms. Generic supplemental/spot cooling techniques, as well as turnkey cooling solutions developed by equipment manufacturers are viable solutions. Such solutions could allow very high heat release equipment to be housed in a central office that has a heat density at or near the cooling capacity available from the central air handler. According to Telcordia GR-3028, Thermal Management in Telecommunications Central Offices, the most common way of cooling modern telecommunications equipment internally is by utilizing multiple high-speed fans to create forced convection cooling. Although direct and indirect liquid cooling may be introduced in the future, the current design of new electronic equipment is geared towards maintaining air as the cooling medium.

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